Senba Sensing Technology Co., Ltd.
Technical Support

Technical Support

  • 08
    06
    2021
    DIP PIR Applicaiton Note
    Directions for Use1. Circuit design(1) The connection between PIR and other devices should be as short as possible. On the double-panel or multi-layer board, try not to trace the line below the connec...
  • 10
    07
    2019
    Precautions for PIR Processing
    a. The lead of the sensor base is recommended to be soldered at a position of 4 mm or more. The soldering time should be as short as possible. When soldering, please keep the soldering iron at a tempe...
  • 10
    07
    2019
    PIR Sensor Product Name
    BS312IC TypeWindows SizePinsPower Supply Voltage CharacteristicsElements S18- L232B- 2TypeWindows SizeElements PinsPZT Material IFeatureD203SDual/ Quad Elements Windows Size
  • 10
    07
    2019
    Pin Description
    1. 3 PINS2. 4 PINS3. 6 PINS
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